[Fab15 HVM] - Dry Etch Process Equipment Engineer
Core
Lead dry etch process and equipment engineering for high-volume manufacturing of advanced DRAM semiconductors, focusing on yield improvement, productivity enhancement, and new equipment integration.
Role type
Senior IC process equipment engineer (semiconductor manufacturing)
Builds
High-volume manufacturing of advanced DRAM memory products
Domain
Semiconductor manufacturing / Memory and storage solutions
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Process and equipment engineering, yield management, production planning, project coordination, cross-functional collaboration, problem-solving, technical reporting
Preferred skills
Physics, chemistry, mechanical, or electrical engineering fundamentals
Technologies
Dry etch equipment, Microsoft Office (Excel, PowerPoint, Word)
Responsibilities
Improve yield and management systems for mass production, support introduction and modification of new advanced equipment, identify and resolve product/manufacturing issues during product introduction, lead improvement activities with equipment and process engineers and technicians, report on daily issues and long-term projects to leadership and stakeholders, participate in technical exchanges with overseas Micron production sites to standardize processes