STAFF/PRINCIPAL ENGINEER - CMP PROCESS DEV
Core
Lead Chemical Mechanical Planarization (CMP) process development for advanced 3D NAND and future technology nodes, driving process characterization, margin improvement, and transfer to high-volume manufacturing.
Role type
Staff/Principal IC Process Development Engineer (CMP, NAND)
Builds
Advanced 3D NAND memory and storage products
Domain
Semiconductor manufacturing / Materials Science
Required skills
CMP process development (dielectric/metal polishing), NAND process integration, Design of Experiments (DOE), root-cause analysis, statistical data interpretation, process monitoring/control strategies, equipment evaluation (EBARA/Applied Materials), cross-functional technical leadership
Preferred skills
Transfer of processes to high-volume manufacturing, patent generation, technical paper publication
Technologies
EBARA WS, Applied Materials platforms, Y3
Responsibilities
Lead CMP process characterization and advanced development for 3D NAND; Define and execute CMP process strategies to improve margin, robustness, and yield; Lead complex experiments and data analysis to validate process windows; Drive transfer of CMP processes to high-volume manufacturing at Fab10N; Collaborate with global development, manufacturing, and supplier teams; Resolve complex process, yield, and defectivity challenges using data-driven decision-making; Develop advanced process monitoring and control methodologies; Mentor junior CMP engineers and strengthen engineering standards.
Seniority
Staff/Principal, hands-on IC with strategic influence