Dry Etch - MTS, PD, Advance NAND
Core
Lead critical modules in Next Generation NAND research and development, specifically focusing on dry etch technology, process integration, and scaling solutions for advanced memory products.
Role type
Senior IC semiconductor process engineer (dry etch)
Builds
Next Generation NAND memory products and advanced dry etch equipment roadmaps
Domain
Semiconductor manufacturing / Memory storage (NAND)
Required skills
Dry etch process development, Plasma physics and chemistry, Statistical process control, High aspect ratio etch solutions, Technical leadership, Multi-functional team collaboration, Equipment roadmap planning, Supplier management, Data analysis (SAS/Python), Semiconductor module development (NAND/DRAM/Logic)
Preferred skills
Data science basics, Python coding, AI tools proficiency
Technologies
RF sources, Dry etch chambers, SAS (JmP), MS Office, Python
Responsibilities
Develop and innovate dry etch processes to meet structural and electrical specifications, Lead multi-functional teams to solve complex structural problems, Collaborate with process integration areas (Wet Etch, CVD, Lithography, etc.), Mentor less-experienced engineers, Present technology development plans for current and upcoming nodes, Predict and mitigate future process issues, Guide other areas' technology roadmaps, Lead supplier head-to-heads
Seniority
Senior, hands-on IC with technical leadership responsibilities