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Advanced Technology Japan Engineer, Dry Etch

Hiroshima, Japan💼 Full-time🗓 2026-05-11 → 2026-09-26

Core

Establish and improve semiconductor dry etch process conditions and technology to enhance product quality, yield, and cost efficiency.

Role type

Semiconductor Fab Process Engineer (Dry Etch)

Builds

High-performance DRAM, NAND, and NOR memory and storage products

Domain

Semiconductor manufacturing / Dry Etch

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work -> physical/clinical work (Note: This is a manufacturing role, so 'physical/clinical work' is the closest fit for hands-on fab work, but strictly speaking, it's 'production features' or 'infrastructure'. Let's refine based on the 'Deliverable' options. The role builds the process capability for products. The most accurate from the list is 'product features' (defining the process features) or 'infrastructure' (fab infrastructure). However, the prompt asks for 'what the team ships'. They ship memory chips. But the role is process engineering. Let's look at the options again: 'production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work'. None fit perfectly. 'Infrastructure' usually means cloud/fab infrastructure. 'Product features' usually means software. Given the context of 'process parameters' and 'equipment', 'infrastructure' is often used for fab roles in these schemas, or 'physical/clinical work' for hands-on. Let's select 'infrastructure' as it relates to the manufacturing infrastructure/process.

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