Engineer CE PYE (Physical Failure Analysis/Fault Isolation)
Core
Perform fault isolation and physical failure analysis to root-cause electrical and physical defects in semiconductor devices.
Role type
Senior IC physical failure analysis engineer
Builds
Semiconductor memory and storage products (NAND, DRAM, HBM)
Domain
Semiconductor manufacturing / Hardware reliability
Required skills
electrical device characterization, fault isolation equipment operation, physical defect identification, electrical fail modeling, process flow understanding, defect classification, root cause analysis, tool maintenance coordination
Preferred skills
NAND/DRAM/HBM device knowledge, Fab process knowledge, AI/machine learning for fault isolation, data analytics for process optimization
Technologies
fault isolation equipment, electrical characterization tools, physical analysis tools
Responsibilities
Perform sophisticated electrical device characterization to determine electrical fail mechanisms. Operate fault isolation equipment to accurately narrow down failure defect locations. Conduct physical failure analysis to identify and classify physical defects. Establish and hypothesize potential electrical or process fail mechanisms based on detailed electrical fail models and physical failure analysis characterization. Coordinate the maintenance and high uptime of fault isolation and physical failure analysis tools to ensure world-class operational efficiency.
Seniority
Mid-to-Senior, hands-on IC
