Senior Integrated Photonics Packaging Engineer (m/f/d)
Core
Research, develop, and demonstrate novel electrical and optical packaging concepts for photonic integrated circuits (PICs) to enable scalable, energy-efficient AI and high-performance computing systems.
Role type
Senior IC integrated photonics packaging engineer
Builds
Photonic processing systems and PIC-based modules for AI and HPC
Domain
Deep tech / Photonics / Optoelectronics / AI Hardware
Required skills
Photonic integrated circuit (PIC) packaging, hybrid integration, optical coupling schemes, RF/microwave signal integrity, thermal management, flip-chip/wire bonding, die attach, hermetic encapsulation, optical characterization, electrical characterization, CAD layout, optical simulation
Preferred skills
Experimental packaging or integration focus, Zemax, Lumerical
Responsibilities
Conceive, build, and experimentally validate novel packaging prototypes; Lead packaging R&D workstreams from concept to validation; Solve complex optical coupling, RF signal integrity, and thermal management challenges; Design, build, and measure advanced optical coupling schemes; Partner with PIC designers and systems engineers; Document process recipes and assembly procedures; Coordinate with external partners for specialized materials; Mentor junior engineers
Seniority
Senior, hands-on IC with mentorship
