Senior Integrated Photonics Packaging Engineer (Photonics)
Core
Define and own optical packaging architecture and high-density packaging solutions for photonic processing systems that compute with light.
Role type
Senior IC integrated photonics packaging engineer
Builds
Proprietary, high-density optical packaging solutions uniting PICs, laser sources, photodetectors, and analog circuitry
Domain
Semiconductor back-end integration / AI computing infrastructure
Deliverable
production ML models
Required skills
Optical coupling strategies, thermal management, Design for Manufacturability (DFM), root-cause analysis, supplier-led R&D project management, optical design tools, material selection
Preferred skills
German language, advanced optical design tools
Technologies
Zemax, CODE V, 8D, Ishikawa
Responsibilities
Define optical packaging architecture, lead supplier-driven R&D projects, implement advanced optical coupling and thermal management concepts, drive DFM and material selection, perform root-cause analysis on integration failures, implement novel packaging concepts, collaborate with internal R&D and manufacturing teams
Seniority
Senior, hands-on IC