Team Lead Co-Packaged Optics (m/f/d)
Core
Architectural and leadership anchor for a new Co-Packaged Optics (CPO) packaging team, driving the transition from concept to high-volume production at the intersection of photonics and electronics.
Role type
Senior IC Team Lead (Semiconductor Packaging)
Builds
Co-packaged photonic/electronic assemblies and advanced packaging materials
Domain
Semiconductor industry + Photonics/Co-Packaged Optics
Required skills
CPO packaging expertise, OSAT supplier evaluation, optical fiber attachment (Edge Coupling, FAUs), DFM implementation, root-cause analysis (8D, FMEA), thermal management, team building and scaling
Preferred skills
German language proficiency, experience with glass substrates
Technologies
CPO, OSAT, Edge Coupling, FAUs, TIMs, Underfills
Responsibilities
Build and mentor a high-performing CPO Packaging engineering team; evaluate and qualify global OSAT partners; drive development of advanced co-packaged assemblies; implement DFM guidelines; act as interface between Chip Design, Systems, Manufacturing, and supply chain; resolve reliability or process deviations using structured frameworks
Seniority
Senior, hands-on IC with team leadership
