Principal Hardware Application Engineer
Core
Principal Hardware Application Engineer driving design-in and board bring-up for high-speed DC switch platforms (800G, 1.6T) for strategic customers.
Role type
Principal, hands-on IC hardware application engineer
Builds
High-speed Ethernet DC switch platforms (400G, 800G, 1.6T) for data center and carrier architectures
Domain
Semiconductor / High-speed networking / Data center infrastructure
Required skills
Schematic and PCB layout review, Signal Integrity (SI) analysis, Power Integrity (PI) analysis, SerDes tuning, Board bring-up and debugging, Design documentation, Cross-functional collaboration, Next-gen interconnect knowledge (UALink, CPO, 224G SerDes), Supply chain engagement
Preferred skills
DC switch silicon experience (Marvell Teralynx), SI/PI simulation tools (Sigrity, Ansys), Thermal design for high-power platforms, ODM design requirements knowledge, Board bring-up tool expertise (oscilloscopes, VNAs, BERT)
Technologies
Cadence OrCAD, Mentor PADS, Cadence Allegro, Sigrity, Ansys SIwave, HFSS, PowerDC, 800G/1.6T Ethernet, UALink, CPO, 224G SerDes
Responsibilities
Review customer PCB schematics and layouts for DC switch platforms; Perform SI/PI simulations for high-speed interfaces; Support hardware bring-up and debug L1 issues at customer sites and labs; Author hardware design guides and application notes; Collaborate with global engineering teams on design reviews; Engage with supply chain to optimize platform designs
Seniority
Principal, hands-on IC
