Electro-optical Signal Integrity, Principal Engineer
Core
Define, simulate, and drive the architecture of high-frequency electrical interfaces for next-generation optical engines (400G/lane CPO and beyond) at the intersection of silicon photonics, advanced packaging, and high-speed electronics.
Role type
Principal Engineer, Electro-optical Signal Integrity
Builds
Silicon photonics-based optical engines and components for next-generation AI and data center infrastructure
Domain
Semiconductor, Silicon Photonics, High-Speed Electronics, Data Infrastructure
Deliverable
production ML models | product features | infrastructure
Required skills
Signal integrity strategy, RF/microwave engineering, high-frequency circuit theory, interconnects, silicon photonics, semiconductor packaging, optical communications (coherent/IM/DD), high-frequency characterization (>110 GHz), electro-optical device testing, 3D EM modeling, high-frequency circuit simulation, RF PCB design, high-speed link modeling, channel budgets, equalization techniques, SerDes interfacing, advanced packaging
Preferred skills
Python or MATLAB for lab automation, high-speed testing (VNA, AWG, PPG, oscilloscope, DCA, BERT), 2.5D/3D integration in optical platforms
Technologies
HFSS, ADS, VNA, AWG, PPG, oscilloscope, DCA, BERT, Python, MATLAB, IEEE 802.3, OIF CEI
Responsibilities
Define and simulate architecture of high-frequency electrical interfaces, lead signal integrity strategy across electrical and electro-optical interfaces, drive co-design across photonics, analog/ASIC, and packaging teams, lead testing and qualification of components and systems, develop and validate end-to-end link budgets, analyze measurement data to identify performance limitations, lead root cause analysis of complex signal integrity issues
Seniority
Principal, hands-on IC with strategy & mentorship