ENGINEER SR, PACKAGE DEVELOPMENT
Core
Technical owner for semiconductor assembly process qualification, optimization, and production readiness from development through high-volume manufacturing.
Role type
Senior IC NPI Assembly Engineer
Builds
Semiconductor packages (Die Attach, Wire Bond, Wafer Saw, Molding, Trim & Form, Singulation, Marking, Packing)
Domain
Semiconductor manufacturing / Electronics
Required skills
Semiconductor assembly process development, DOE, FMEA, Root Cause Analysis, Reliability Testing, Statistical Process Control, Yield improvement, Equipment qualification, Lean Manufacturing, Six Sigma
Preferred skills
Automotive quality requirements (IATF 16949, APQP), Minitab/JMP data analysis
Technologies
Minitab, JMP, Excel
Responsibilities
Define assembly manufacturing flow and process parameters, Lead process characterization studies and DOE, Troubleshoot process issues during pilot builds and production ramp-up, Lead failure analysis and root cause investigations, Create and maintain Process Flow, FMEA, Control Plan, and Work Instructions, Drive yield enhancement and cost reduction initiatives, Act as technical focal point for customers during NPI programs
Seniority
Senior, hands-on IC
