ENGINEER SR, PACKAGE DEVELOPMENT
Core
Senior NPI Assembly Engineer responsible for executing semiconductor assembly processes from development through high-volume manufacturing, ensuring new products meet quality, cost, and reliability requirements.
Role type
Senior IC manufacturing engineer (semiconductor assembly)
Builds
Semiconductor packages (die attach, wire bond, molding, etc.)
Domain
Semiconductor manufacturing / Electronics
Required skills
Semiconductor assembly process development, DOE, FMEA, root cause analysis, yield improvement, reliability testing, SPC, Lean Manufacturing, Six Sigma, statistical analysis, equipment qualification, process validation
Preferred skills
Automotive quality standards (IATF 16949, APQP), Minitab/JMP/Excel, 8D problem solving, MSA
Technologies
Minitab, JMP, Excel
Responsibilities
Define assembly manufacturing flow and process parameters, lead process characterization studies and DOE, troubleshoot process issues during pilot builds, lead failure analysis and root cause investigations, create and maintain process documentation (FMEA, Control Plan, Work Instructions), drive yield enhancement and cost reduction initiatives, act as technical focal point for customers during NPI programs
Seniority
Senior, hands-on IC
