Semiconductor Packaging Modeling and Simulation Engineer
Core
Perform thermal-mechanical simulation for microelectronic packaging, assembly processes (Ag/Cu sintering), and system reliability analysis to support new power module development.
Role type
Semiconductor packaging modeling and simulation engineer
Builds
Power modules and semiconductor packaging solutions
Domain
Semiconductor industry, thermal-mechanical engineering
Deliverable
production ML models | product features | dashboards & analysis
Required skills
thermal-mechanical modeling, crystal plasticity, Cu/Ag sintering processes, non-linear solid mechanics, fracture mechanics, delamination analysis, FEA (ANSYS Mechanical APDL/Work Bench), CAD (Solidworks), Unix/Linux, model correlation to empirical data
Preferred skills
Digital Twin, AI, machine learning algorithms, probability and optimization algorithms
Technologies
ANSYS Mechanical APDL, ANSYS Work Bench, Solidworks, Unix/Linux
Responsibilities
Perform thermal-mechanical simulation for microelectronic packaging and assembly processes; analyze reliability issues induced by thermal problems; develop and maintain state-of-the-art thermal-mechanical modeling methodology; setup and maintain HW/SW environment for thermal modeling; provide support to other thermal modeling users; innovate new technology through simulation.
Seniority
Mid-level, hands-on IC
