ENGR STAFF, R&D ENGINEERING; PKG&ASSY
Core
Leading New Product Introduction (NPI) activities for semiconductor assembly processes from development through high-volume manufacturing, serving as the technical owner for process qualification, optimization, and production readiness.
Role type
Staff NPI Assembly Engineer
Builds
Semiconductor packages (Die Attach, Wire Bond, Wafer Saw, Molding, Trim & Form, Singulation, Marking, Packing)
Domain
Semiconductor manufacturing / Assembly processes
Required skills
Semiconductor assembly process development, Process qualification, DOE (Design of Experiments), FMEA, Root cause analysis, Yield improvement, Reliability testing (HTOL, TC, HAST, MSL), Statistical Process Control (SPC), Lean Manufacturing, Six Sigma, Equipment qualification, Data analysis (Minitab, JMP)
Preferred skills
Automotive quality requirements (IATF 16949, APQP), Statistical analysis
Technologies
Minitab, JMP, Excel
Responsibilities
Define assembly manufacturing flow and process parameters, Lead process characterization studies and DOE, Troubleshoot process issues during pilot builds and production ramp-up, Lead failure analysis and root cause investigations, Create and maintain Process Flow, FMEA, Control Plan, and Work Instructions, Drive yield enhancement and cost reduction initiatives, Act as technical focal point for customers during NPI programs
Seniority
Staff, hands-on IC
