Manufacturing Integration Engineer
Core
Drive technology transfer and manufacturability for next-generation discrete power FET technologies from concept definition through high-volume manufacturing.
Role type
Manufacturing Integration Engineer (Semiconductor)
Builds
Discrete power FET devices (trench MOSFETs, superjunctions) for end-customer applications
Domain
Semiconductor manufacturing / Power electronics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor physics, device reliability, 300mm fabrication, DOE, statistical analysis, SPC, 6-sigma, FMEA, root-cause analysis, project management
Preferred skills
Post-wafer fab operations (Back-Grind, Back Metallization, Packaging, Dicing, Singulation, module construction), wafer level testing (ILT/WAT/PCM, Probe), package-level final testing
Technologies
300mm fabrication, trench MOSFETs, superjunctions, Back-Grind, Back Metallization, Packaging, Dicing, Singulation, ILT, WAT, PCM, Probe
Responsibilities
Partner with process module owners to optimize process windows and ensure device robustness; Perform device characterization, electrical testing, and failure analysis; Drive structured root-cause analysis for yield and reliability issues; Collaborate with systems, product, packaging, and applications teams to integrate power FETs into system-level solutions; Present technical content in executive-level reviews
Seniority
Mid-level, hands-on IC