CareerPlan

Senior Wirebond Process Engineer

Melaka, MalaysiaFull-time2026-10-16 → 2026-11-10

Core

Drive continual improvement of wirebond manufacturing processes, procedures, and equipment in a high-volume 300mm wafer Fab.

Role type

Senior Manufacturing Process Engineer (Wirebond)

Builds

Improved manufacturing procedures, processes, and equipment performance for Analog Technologies

Domain

Semiconductor manufacturing (Analog)

Required skills

wirebond process development, statistical process control, engineering change control, process release strategies, lot and equipment disposition, problem resolution, data analysis

Preferred skills

analytical and problem solving, statistical monitoring, project management, cost reduction, new product support

Technologies

KNS wirebond machines, ASM wirebond machines, wedge bonder wirebond machines

Responsibilities

Develop and implement improved manufacturing methods and procedures; Support wirebond processes for customer deliverable materials; Define applicable wirebond materials and statistical monitoring methods; Execute equipment/process startup and process experiments; Perform lot and equipment dispositions to minimize cycle time; Identify and resolve systematic process or equipment problems.

Seniority

Senior, hands-on IC