CareerPlan

Senior Process Technician (Die Prep, Wirebond, Die Attach, Mold, STF, Test)

Melaka, MalaysiaFull-time2026-10-16 → 2026-11-10

Core

Support semiconductor wafer fabrication processes including die prep, wirebond, die attach, mold, and test operations within a clean room environment.

Role type

Senior Process Technician (Semiconductor Manufacturing)

Builds

Semiconductor chips and integrated circuits

Domain

Semiconductor manufacturing / Wafer fabrication

Required skills

Semiconductor process knowledge, wirebond, die bond, die prep, trim&form, mold, test operations, technical testing, process monitoring, line operator guidance, production material disposition

Preferred skills

Multi-tasking, rapid issue resolution, process flow understanding, troubleshooting electrical and mechanical systems, attention to detail