Senior Die Prep / Pre Assembly process engineer
Core
Drive continual improvement in die prep and pre-assembly processes within a high-volume 300mm wafer Fab manufacturing Analog Technologies.
Role type
Senior Manufacturing Process Engineer (Die Prep/Pre-Assembly)
Builds
Improved manufacturing procedures, processes, and equipment operations for Analog Technologies
Domain
Semiconductor manufacturing (300mm wafer Fab)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
statistical process control, engineering change control, process release strategies, backgrind process, mechanical saw process, Laser Saw Process, lot and equipment disposition, data analysis, problem resolution
Preferred skills
new product support, cost reduction programs, quality improvement programs
Technologies
300mm wafer Fab equipment
Responsibilities
Support manufacturing operations, develop and implement improved manufacturing methods and procedures, implement project or improvement plans for efficiency and quality, perform lot and equipment dispositions, identify systematic problems in process or equipment, support manufacturing ramp with equipment/process startup and process experiments, participate in data analysis and problem resolution
Seniority
Senior, hands-on IC