Summer 2027 Internships - Design Engineering
Core
Summer 2027 internship for early-career students to work on semiconductor design projects including analog/mixed-signal, digital, verification, physical design, RF, or design automation.
Role type
Summer 2027 Design Engineering Intern
Builds
Semiconductor products (SoCs, wireless connectivity solutions)
Domain
Semiconductor / Hardware Design
Deliverable
production ML models | product features | research | infrastructure
Required skills
Analog/Mixed-Signal circuit design, Digital logic design, RTL development, Verification environment development, Physical design/layout, RF circuit design, Design automation scripting, Verilog, SystemVerilog, VHDL, Python, C/C++, MATLAB, EDA tools (Cadence, Synopsys, Siemens)
Preferred skills
Coursework in Electrical/Computer Engineering, Research or prior internship experience in semiconductor design, Exposure to VLSI or signal processing
Technologies
Verilog, SystemVerilog, VHDL, UVM, Python, C/C++, MATLAB, Cadence, Synopsys, Siemens EDA
Responsibilities
Design, simulate, and evaluate analog/mixed-signal circuits; Support RTL development and microarchitecture; Develop verification environments and test plans; Support physical implementation including floor planning and timing closure; Contribute to RF circuit design and testing; Develop software tools and workflows for design efficiency
Seniority
Intern (Student)