CareerPlan

New College Grad - Design Engineer, HBM

Richardson, Texas, United States of AmericaFull-time2026-07-13 → 2026-10-23

Core

Design and validate digital, analog, and mixed-signal circuits for next-generation memory products, specifically HBM architectures, optimizing for manufacturability, cost, and quality.

Role type

New College Grad Design Engineer (HBM)

Builds

Next-generation memory products (HBM)

Domain

Semiconductor / Memory / HBM

Required skills

CMOS circuit design, semiconductor device physics, schematic entry, Verilog, FastSPICE, HSPICE, timing/power/area trade-offs, AI-enabled simulation tools

Preferred skills

Statistical/Monte Carlo simulation, mixed-signal verification, memory interfaces, HBM architectures, RTL design flow

Technologies

Verilog, FastSPICE, HSPICE, AI tools

Responsibilities

Support circuit design, layout, and optimization for memory and logic/analog circuits; Perform parasitic modeling and design validation; Oversee layout process (floor-planning, placement, routing); Perform verification using modeling and simulation; Collaborate across teams to drive standardization; Partner with Marketing, Test, and Process Integration to support manufacturability

Seniority

Entry-level, New College Grad