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Head of Mechanical Design

Hong Kong - Science Park💼 Full-time🗓 2026-03-18 → 2026-09-26

Core

Lead mechanical and packaging design for next-generation 1.6T client-side optical transceivers, focusing on high-speed optical module packaging, thermal management, and COB assembly processes.

Role type

Senior IC mechanical design manager (optical modules)

Builds

High-performance, manufacturable, and reliable 1.6T optical modules

Domain

Telecommunications / High-speed optical interconnects

Deliverable

production ML models | product features

Required skills

Mechanical CAD (SolidWorks, AutoCAD), thermal simulation (ANSYS, FloTHERM, Icepak), die bonding, wire bonding, optical coupling, precision machining, DFM/DFA, MSA compliance

Preferred skills

800G/400G optical module experience, injection molding, die-casting, epoxy dispensing, underfill, encapsulation

Technologies

SolidWorks, AutoCAD, ANSYS, FloTHERM, Icepak

Responsibilities

Lead mechanical and packaging design for 1.6T optical modules; Optimize module housing, PCB layout integration, and thermal dissipation strategies; Develop thermal solutions and conduct thermal simulations; Collaborate with process engineers to optimize assembly processes; Coordinate with cross-functional teams to optimize module performance; Mentor junior engineers and contribute to design reviews and failure analysis

Seniority

Senior, hands-on IC

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