Head of Mechanical Design
Core
Lead mechanical and packaging design for next-generation 1.6T client-side optical transceivers, optimizing module performance, manufacturability, and thermal management.
Role type
Senior IC mechanical design manager (optical modules)
Builds
High-speed optical transceiver modules (1.6T)
Domain
Telecommunications / Optical Interconnects
Required skills
Mechanical CAD (SolidWorks, AutoCAD), Thermal simulation (ANSYS, FloTHERM, Icepak), Die bonding, Wire bonding, Optical coupling, Precision machining, DFM/DFA, MSA compliance
Preferred skills
800G/400G optical module experience, Mandarin language
Technologies
SolidWorks, AutoCAD, ANSYS, FloTHERM, Icepak
Responsibilities
Lead mechanical and packaging design for 1.6T optical modules; Optimize module housing, PCB layout integration, and thermal dissipation strategies; Develop thermal solutions and conduct thermal simulations; Collaborate with process engineers to optimize epoxy dispensing, underfill, and encapsulation; Coordinate with optical, electrical, and test engineers to optimize module performance; Mentor junior engineers and contribute to design reviews and failure analysis.
Seniority
Senior, hands-on IC
