Mechanical Engineering Technical Leader || Electro-mechanical Packaging || CREO, FEA || DFM/DFA || ASIC System Integration || Exp - 11+ years
Core
Lead mechanical engineering for electro-mechanical packaging of next-generation Telecom and Datacentre products, focusing on thermal management, structural simulation, and ASIC system integration.
Role type
Senior Mechanical Engineering Technical Leader (Electro-mechanical Packaging)
Builds
Next generation Telecom & Datacentre hardware products
Domain
Telecom & Datacentre hardware, electro-mechanical packaging, thermal management
Deliverable
product features
Required skills
Solid modeling (Creo, UG-NX), Structural simulation (Ansys), System thermal analysis, Cooling methodologies, ASIC system integration, Technical team leadership, Process improvement, Documentation and data management
Preferred skills
Mechanical reliability testing, Material selection for corrosive environments
Technologies
Creo, UG-NX, Ansys
Responsibilities
Define architecture and implementation for packaging solutions; Collaborate with ASIC teams on system-level integration; Develop and implement design improvement guidelines; Assist in subsystem lab bring-up, integration, and validation; Mentor team members and formulate growth processes.
Seniority
Senior, hands-on IC with leadership responsibilities
