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Senior Thermal/Hardware Engineer

Singapore, Central Singapore, Singapore💼 Full-time🗓 2026-06-24 → 2026-07-30

Core

Lead system-level thermal design, simulation, and validation for high-density, high-power networking platforms from concept to mass production.

Role type

Senior IC thermal/hardware engineer (electronics packaging)

Builds

High-density networking platforms, line cards, and chassis

Domain

Data center and networking hardware

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Thermal design, electronics packaging, CFD simulation (FloTHERM), thermal test setup and instrumentation, manufacturing processes, Python scripting, system-level tradeoffs

Preferred skills

Fan selection and control methodologies, design for manufacturability, root-cause analysis, cross-functional collaboration

Technologies

FloTHERM, thermocouples, DAQs, environmental/thermal chambers, airflow/pressure benches

Responsibilities

Lead system-level thermal design, simulation, and validation; Own end-to-end thermal development lifecycle; Design and validate thermal solutions for enclosures and line cards; Define and execute thermal validation test plans; Drive system-level design tradeoffs; Engage manufacturing partners; Lead root-cause analysis; Provide technical mentorship

Seniority

Senior, hands-on IC with team leadership

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