CareerPlan

SOC Thermal Engineer

San Francisco Bay Area, United States of AmericaFull-time2026-09-28 → 2026-11-04

Core

Design and validate cooling solutions for high-performance computing systems and mobile devices, focusing on thermal analysis, simulation, and testing to ensure performance and reliability.

Role type

Senior IC thermal engineer (SoC packaging)

Builds

Mobile devices and high-performance computing systems

Domain

Semiconductor industry + thermal engineering

Required skills

thermal analysis, thermal modeling, simulation, experimental test setup design, thermal data analysis, cooling solution integration, IC physical design knowledge, advanced packaging process knowledge, low-power design techniques, thermal testing

Preferred skills

leadership capabilities, deep expertise in thermal design for silicon devices, SoC design methodologies, advanced packaging assembly processes, hands-on experience with high-power SoCs

Technologies

Ansys IcePak, Sentinel-TI, Fluent, Cadence Allegro, RedHawk