Principal AI Network Technical Lead
Core
Lead the end-to-end hardware development and technical strategy for next-generation AI network switches and optical interconnect solutions, serving hyperscale AI clusters and data centers.
Role type
Principal AI Network Technical Lead (Hardware Architect)
Builds
Next-generation scale-up switches, optical interconnects (OCI, XPO, CPO), and AI cluster rack systems.
Domain
AI Infrastructure / High-Performance Networking / Hardware Engineering
Deliverable
production ML models | product features | infrastructure
Required skills
ASIC design, SerDes (112G/224G), optical networking (CPO, OCI, XPO), system-level hardware architecture, cross-functional team leadership, ODM/JDM management, thermal/power design, validation and qualification.
Preferred skills
Experience with SONiC, RDMA/RoCE, high-speed interconnects, rack-scale system integration.
Technologies
SONiC, CPO, OCI, XPO, 112G SerDes, 224G SerDes, PAM4, retimers, DR optics
Responsibilities
Drive switch vendor selection and supplier engagement strategy; own switch hardware development including ASICs, SerDes, and thermal design; lead switch bring-up, validation, and production readiness; integrate switches into AI clusters; lead cross-functional teams across silicon, optics, and software.
Seniority
Principal, hands-on IC with strategy & mentorship