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Principal Test Engineer

United States, Oregon, Hillsboro💼 Full-time🗓 2026-08-27 → 2026-09-26

Core

Lead scan (structural) test engineering for semiconductor IC development, covering silicon bring-up, manufacturing readiness, and yield analysis.

Role type

Principal Test Engineer (Scan/Structural Test)

Builds

ATE test programs, scan patterns, and validation flows for logic defects

Domain

Semiconductor / Integrated Circuit Design

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Scan architecture, ATPG, fault models, silicon fabrication processes, product qualification, reliability, transistor theory, DFT features (SAF/TDF, JTAG, boundary scan, at-speed testing), scan diagnosis tools, failure analysis, yield improvement, simulation, emulation, pattern verification, mixed-signal IP test interaction, device physics, computer architecture fundamentals, Linux environments, unit and integration testing, test program debugging, optimization, probability, statistics, DOE concepts

Preferred skills

Mixed-signal IP test development, advanced-node designs, high-performance computing, AI, GPUs, telecom

Technologies

Advantest 93K, Linux

Responsibilities

Contribute to silicon bring-up, validation, and manufacturing readiness; Execute defined test plans and methodologies; Identify issues and escalate risks with clear technical data; Collaborate with design, DFT, product, and manufacturing teams; Support scan test content generation, pattern validation, and post-silicon debug; Perform failure analysis using scan diagnosis tools to identify defect locations and support yield improvement; Work with DFT teams on simulation, emulation, and pattern verification

Seniority

Principal, hands-on IC development and strategy

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