Principal Optical Packaging Engineer
Core
Lead the design and development of packaging architectures for co-packaged optics, integrating photonic devices, ASICs, and interposers to optimize signal integrity, power delivery, and thermal performance.
Role type
Principal Optical Packaging Engineer (CPO Architecture & Packaging Co-Design)
Builds
Co-packaged optics solutions leveraging 2.5D/3D integration (FOWL, CoWoS, EMIB, SOIC/HB), fiber attach, and optical coupling for hyperscale data center interconnects.
Domain
Semiconductor packaging, photonics, and hyperscale data center infrastructure.
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Advanced semiconductor packaging (FCBGA, 2.5D/3D integration), optical assembly & alignment strategies, thermal management, cross-disciplinary co-design, prototyping & validation, Tier-1 supplier engagement, systems mindset for yield/cost/reliability.
Preferred skills
Master's or PhD in Electrical Engineering, Photonics, or Materials Science, experience with hyperscale data center interconnect requirements, background aligned with leading CPO practitioners.
Technologies
FOWL, CoWoS, EMIB, SOIC, HB, fiber attach, optical coupling.
Responsibilities
Define and prototype packaging solutions, develop scalable optical assembly processes, collaborate with photonics/electronics/system teams to co-optimize performance, build and evaluate prototypes to identify failure modes, drive technology towards production readiness with Tier-1 partners.
Seniority
Principal, hands-on IC with strategy & mentorship
