CareerPlan

先进内存创新方案高级工程师

Shanghai, ChinaFull-time2026-10-19 → 2026-11-10

Core

Research, planning, and innovation for advanced memory technologies including near-memory computing, compute-in-memory, and advanced memory packaging.

Role type

Senior IC advanced memory technology engineer

Builds

Memory device specifications, performance/power/system models for end-side AI and imaging scenarios

Domain

Semiconductor industry + advanced memory architecture

Required skills

memory architecture, memory protocols, performance/power analysis, near-memory computing, compute-in-memory, advanced packaging, FPGA prototyping, system modeling

Preferred skills

hardware prototyping, modeling, project leadership

Technologies

FPGA, memory architectures, system modeling tools

Responsibilities

Define memory device specifications for end-side AI and imaging business scenarios; build performance, power, and system benefit models for different memory architectures to support technology selection and competitive solution design; research and plan advanced memory technologies including near-memory computing, compute-in-memory, and advanced memory packaging.