Sr. Principal Hardware Engineer
Core
Lead the end-to-end design and development of next-generation high-performance networking hardware and liquid-cooled scale-up systems.
Role type
Sr. Principal Hardware Engineer (System Architecture & Board Design)
Builds
High-density, high-power circuit boards and liquid-cooled data center systems for networking and AI/ML workloads.
Domain
Networking hardware, High-Performance Computing (HPC), AI/ML infrastructure, Liquid cooling
Required skills
High-speed signaling (100G/200G), High-density PCB design, FPGA development, Signal Integrity (SI) analysis, Power Integrity (PI) analysis, Thermal management (liquid cooling), System architecture, Mechanical integration
Preferred skills
Experience with scale-up systems, High-performance computing, Networking, AI/ML accelerators
Technologies
100G/200G interfaces, FPGA, Liquid cooling systems, Cold plates, Manifolds
Responsibilities
Own the hardware design lifecycle from concept to production, Design high-performance high-density circuit boards, Develop FPGA solutions and integrate with hardware/firmware, Perform SI/PI analysis, Collaborate on liquid cooling architectures, Identify technical risks and drive solutions
Seniority
Principal, hands-on IC with strategic ownership
