Senior NPI Engineer
Core
Lead the full lifecycle of Advanced Packaging Technology Development (APTD) programs, ensuring timely delivery of semiconductor packaging initiatives.
Role type
Senior Program Manager (Semiconductor Packaging)
Builds
Advanced packaging solutions (hybrid bonding, CoWoS, chiplet integration) for memory and storage products
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
Program lifecycle management, cross-functional team leadership, CapEx/OpEx planning, governance standards, stakeholder management, advanced packaging flows knowledge, PDE/CPI/NPI frameworks
Preferred skills
Mentorship, continuous improvement, AI tool utilization
Technologies
PDE, CPI, NPI frameworks
Responsibilities
Lead planning, execution, monitoring, and closure of APTD programs; Define program objectives, deliverables, and success metrics; Develop standardized PMO methodologies and tools; Align program goals with organizational charter; Track critical metrics for yield and EOL accountability; Mentor project managers and foster process improvement
