Process Engineer Intern
Core
Support the development, characterization, and optimization of thin film deposition processes for advanced semiconductor packaging applications.
Role type
Intern, Process Engineer (Semiconductor Manufacturing)
Builds
Next-generation semiconductor devices and advanced packaging solutions
Domain
Semiconductor manufacturing / Materials science / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Thin film deposition (CVD, PECVD, PEALD), Wafer processing, Statistical data analysis, Film characterization (thickness, uniformity, refractive index, stress, composition, surface roughness, electrical properties), Root cause analysis, Experimental design (DOE)
Preferred skills
Semiconductor manufacturing process knowledge, Plasma processing, Surface science, Process automation, Data analytics, AI-assisted process optimization
Technologies
CVD, PECVD, PEALD, Metrology tools, Statistical analysis tools
Responsibilities
Design and execute process engineering experiments, Analyze process results to identify performance improvements, Collect and analyze metrology data, Troubleshoot process and equipment issues, Maintain experimental records and engineering logs, Present project progress to engineering leadership
Seniority
Intern, Student
