Process Engineer Intern
Core
Support the development, characterization, and optimization of thin film deposition processes for advanced semiconductor packaging applications.
Role type
Process Engineer Intern
Builds
Next-generation semiconductor devices and advanced packaging solutions
Domain
Semiconductor manufacturing / Materials science
Required skills
Thin film deposition (CVD, PECVD, PEALD), Wafer processing, Metrology, Statistical data analysis, Root cause analysis, Experimental design
Preferred skills
Semiconductor manufacturing knowledge, Plasma processing, Surface science, DOE execution, Technical presentation
Technologies
CVD, PECVD, PEALD, Metrology tools, Statistical analysis software
Responsibilities
Design and execute process engineering experiments, Analyze process results and identify performance improvements, Characterize film properties (thickness, uniformity, stress, composition), Troubleshoot process and equipment-related issues, Maintain experimental records and engineering logs
Seniority
Intern / Student