Lead Technology Architect – Optical Interconnects & Photonics Manufacturing (f/m/x)
Core
Transform deep industry expertise in photonics manufacturing into next-generation equipment concepts for ZEISS to enable photonic integration in semiconductor manufacturing.
Role type
Principal Technology Architect (Optical Interconnects & Photonics Manufacturing)
Builds
Next-generation equipment concepts and architectures for ZEISS semiconductor manufacturing tools
Domain
Semiconductor manufacturing equipment / Integrated photonics / AI data-center infrastructure
Deliverable
production ML models
Required skills
Photonics manufacturing, Process integration, Packaging and assembly, Yield engineering, PDK and design-rule constraints, Wafer-level test, Known-good-die strategies, Process-control requirements, Yield-learning loops
Preferred skills
Professional network in photonics and semiconductor ecosystem, Strong analytical skills, Ability to lead interdisciplinary technical work
Technologies
Lithography optics, Photomask systems, Process control solutions
Responsibilities
Identify manufacturing bottlenecks and unmet equipment needs in photonics ramp-up and scaling, Initiate development of breakthrough concepts and architectures for ZEISS equipment solutions, Work closely with customers, foundries, OSATs, photonics packaging fabs, R&D institutes and internal ZEISS R&D teams to align technology roadmaps, Provide technical leadership to a growing interdisciplinary team, Contribute to the long-term ZEISS SMT technology strategy
Seniority
Principal, strategy & mentorship