Senior or Principal Test Engineer, Texas Institute for Electronics
Core
Lead strategy, requirements, and execution of ATE test, measurement, and reliability functions for advanced packaging devices and 3D heterogeneous integration technologies.
Role type
Senior/Principal Test Engineer (Semiconductor/Advanced Packaging)
Builds
Test platforms, automation solutions, reliability models, and qualification plans for logic, memory, and advanced packaging devices.
Domain
Semiconductor manufacturing / Advanced Packaging / Defense Electronics
Required skills
ATE test SW/HW development, circuit theory, test automation, failure analysis, signal integrity analysis, fixture design, wafer-level probing, cross-functional collaboration
Preferred skills
Python/Perl/Java scripting, 3DHI design flows, RF processes (GaAs/GaN/SiGe), technical writing for defense, complex project leadership
Technologies
Advantest 93K ATE platforms, EDA tools, automation frameworks
Responsibilities
Define test strategy and requirements, develop test platforms and methodologies, implement test automation, guide reliability models and failure analysis, support test infrastructure buildout, author test reports and SOPs
Seniority
Senior/Principal, hands-on IC
