Senior or Principal Test Engineer, Texas Institute for Electronics
Core
Lead strategy, requirements, and implementation of ATE test platforms, measurement systems, and reliability models for advanced packaging devices and 3D heterogeneous integration technologies.
Role type
Senior/Principal Test Engineer (Semiconductor ATE & Advanced Packaging)
Builds
Test platforms, automation frameworks, and reliability qualification plans for 3DHI chiplet-based architectures and microsystems.
Domain
Semiconductor manufacturing, advanced packaging, 3D heterogeneous integration, defense electronics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
ATE test SW/HW development, circuit theory, test automation, silicon debug, failure analysis, fixture design, probe card specification, electromagnetic effects in advanced packaging, wafer-level probing
Preferred skills
Python/Perl/Java scripting, 3DHI design flows, GaAs/GaN/SiGe/CMOS RF processes, automated test frameworks for production screening, technical writing for defense reporting
Technologies
Advantest 93K ATE platforms, EDA tools, automation frameworks
Responsibilities
Define test strategy and requirements for device test and reliability; Develop and oversee test platforms for logic, memory, and advanced packaging; Implement advanced test automation and measurement systems; Guide development of reliability models and failure analysis methodologies; Collaborate with cross-functional teams for product enablement; Support test infrastructure buildout including fixture design and lab setup
Seniority
Senior (5+ years, hands-on IC validation) / Principal (10+ years, strategy & mentorship)
