Assistant or Associate Professor in the Department of Mechanical Engineering
Core
Tenure-track faculty role focused on thermal management solutions for large-scale electronics packaging, including modeling and experiments for electro-mechanical-thermal management in data centers and high-capacity computing.
Role type
Assistant or Associate Professor (Tenure-line)
Builds
Internationally recognized, externally-funded research program and undergraduate/graduate curriculum
Domain
Mechanical Engineering, Thermal Management, Electronics Packaging, AI/High-capacity Computing
Deliverable
production ML models | research
Required skills
Thermal management modeling, electro-mechanical-thermal management, experimental methods, interdisciplinary research leadership, teaching at undergraduate and graduate levels
Preferred skills
Experience in data center electronics, semiconductor innovation, Materials Research Institute collaboration
Technologies
Simulation tools, experimental equipment for thermal/electro-mechanical systems
Responsibilities
Develop externally-funded research program, teach undergraduate and graduate courses, contribute to departmental service and promotion, lead interdisciplinary research collaborations
Seniority
Assistant or Associate Professor (Tenure-line)
