Strategic Student Program: Cross-Domain Manufacturing Systems Engineering Intern (T&I, Spring 2027)
Core
Research and develop a 'silicon-to-rack' engineering initiative integrating EDA, PLM, and AI workflows across semiconductor design, packaging, and system deployment.
Role type
Cross-domain manufacturing systems engineering intern
Builds
Software prototypes, automation tools, and proof-of-concept solutions for semiconductor and system-level design
Domain
Semiconductor manufacturing, EDA, PLM, and AI-enabled engineering workflows
Deliverable
production ML models
Required skills
Semiconductor engineering concepts, EDA/PLM tool usage, AI-assisted workflow investigation, technical documentation, system-level design validation
Preferred skills
Semiconductor packaging design, Linux/scripting environments, CAE methodologies
Technologies
EDA tools, PLM tools, AI workflows, Linux
Responsibilities
Research emerging semiconductor technologies (3D IC), develop software prototypes, document technical findings, investigate AI-assisted engineering workflows, define end-to-end engineering digital threads
Seniority
Intern, academic level
