VP Engineering, IC Design (On-site. West Lafayette, USA)
Core
Lead IC design teams to build brain-inspired wearable computing chips using patented Wi-R technology for real-time, AI-powered human-computer interaction.
Role type
VP of Engineering, IC Design (hands-on IC)
Builds
Custom analog, mixed-signal, RF, and digital ICs for wearable and implantable devices
Domain
Semiconductor / Wearable Computing / Low-Power Wireless
Deliverable
production ML models | product features | infrastructure
Required skills
Analog IC design, Mixed-signal IC design, RF design, SoC architecture, Chip tapeout, Low-power design, Wireless communication, Team leadership, Strategic planning
Preferred skills
System-level design, Hardware/firmware co-design, Startup tapeout experience, Mentorship
Technologies
EDA tools, GDSII, Wi-R technology
Responsibilities
Lead and grow IC design teams across analog, mixed-signal, RF, and digital domains; Own end-to-end chip lifecycle from concept to production; Set architectural direction and technical standards; Work cross-functionally with hardware, firmware, and product teams; Guide vendor/EDA tool engagement and tapeout execution; Hire, mentor, and retain engineering talent; Represent engineering in executive strategy discussions.
Seniority
VP, hands-on IC leadership