Electronics Failure Analysis Engineer (R5258)
Core
Lead materials development and failure analysis investigations for the XBAT vehicle, driving corrective actions to eliminate recurrence across design, manufacturing, and supply chain.
Role type
Senior IC materials and failure analysis engineer (aerospace/defense hardware)
Builds
XBAT autonomous aircraft hardware
Domain
Defense technology / Aerospace / Hardware reliability
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
SEM/EDS operation, X-ray/CT inspection, cross-section preparation, thermal analysis (DSC/TGA/DMA/FTIR), 8D/fault-tree/fishbone/FRACAS methodologies, dye-and-pry, CSAM, knowledge of solder fatigue/intermetallic growth/tin whiskers/electromigration/corrosion, IPC/JEDEC/MIL/ASTM standards
Preferred skills
Running a materials characterization/failure analysis lab, environmental testing (HALT/HASS), PCB fabrication/SMT/polymerics manufacturing processes, Python (NumPy/Pandas/SciPy/Plotly/Matplotlib)
Technologies
SEM, EDS, X-ray, CT, optical microscopy, DSC, TGA, DMA, TMA, FTIR
Responsibilities
Operate and improve materials investigation laboratory equipment; Develop and implement lab procedures for characterization and reporting; Perform failure analysis on electronic and mechanical failures; Conduct mechanical cross-sectioning and non-destructive testing; Manage lab consumables and equipment safety; Work with external laboratories for specialized analysis; Educate stakeholders on materials science fundamentals.
Seniority
Mid-level, hands-on IC
