Backend Process Engineer
Core
Development, optimization, and manufacturing support of backend wafer fabrication processes for Indium Phosphide (InP)–based photonic devices, including DFB lasers, Semiconductor Optical Amplifiers (SOAs), and Gain Chip products.
Role type
Backend Process Engineer (III-V compound semiconductors)
Builds
InP-based photonic devices (DFB lasers, SOAs, Gain Chips)
Domain
Semiconductor manufacturing / Optoelectronics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
backend semiconductor processing, lapping/thinning, metallization, thermal processes, AOI systems, yield analysis, statistical analysis (SPC/DOE), singulation, packaging interfaces, reliability engineering
Preferred skills
InP or III-V optoelectronic devices, AR/HR optical coating processes, high-mix low-volume manufacturing
Technologies
AOI systems, RTA, SPC tools, DOE tools
Responsibilities
Own and optimize backend wafer fab processes (lapping, metallization, RTA), maintain AOI processes for defect detection, drive singulation yield improvement, support new product introduction and process transfers, author and maintain process documentation (SOPs, control plans), provide hands-on manufacturing troubleshooting
Seniority
Mid-level, hands-on IC
