Microelectronics Fabrication & Process Integration Engineer, MOSIS 2.0
Core
Translate innovative semiconductor process designs into fabricated and packaged hardware through a network of university and industry fabrication partners.
Role type
Microelectronics Fabrication & Process Integration Engineer
Builds
Semiconductor prototyping projects, fabricated hardware, and packaged devices
Domain
Semiconductor manufacturing, nanofabrication, microelectronics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
semiconductor device physics, fabrication fundamentals, process development, troubleshooting, yield improvement, lithography, deposition, etch, metrology, wafer-to-package transition coordination, process transfer readiness, data-driven process optimization, AI/ML-enabled manufacturing analytics
Preferred skills
advanced degree in related field, hands-on experience in micro- or nanofabrication
Technologies
lithography, deposition, etch, metrology
Responsibilities
Support semiconductor prototyping projects from technical intake through fabrication, metrology, packaging coordination, and production handoff; Translate customer requirements into executable fabrication process plans and assist with feasibility assessments; Serve as a technical liaison to partner university nanofabrication facilities and industry fabs; Assist with process development, recipe documentation, troubleshooting, and yield improvement efforts; Coordinate wafer-to-package transitions and collaborate with packaging partners on assembly and test requirements; Support process transfer and readiness assessments across partner facilities; Collaborate with internal research teams on data-driven process optimization and AI/ML-enabled manufacturing analytics; Maintain documentation of process flows, metrology results, and partner capabilities
Seniority
Mid-Senior level, hands-on IC
