Principal Analog Mixed-Signal IC Design Engineer (Data Converters) - TeraWave
Core
Lead architecture, development, and integration of high-speed ADCs and DACs in advanced FinFET CMOS technologies for space-based satellite communications systems.
Role type
Principal IC Design Engineer (Analog Mixed-Signal / Data Converters)
Builds
High-performance ADCs and DACs for TeraWave satellite constellation payloads
Domain
Aerospace / Satellite Communications / Analog Mixed-Signal IC Design
Deliverable
production ML models | product features
Required skills
High-speed ADC/DAC design in FinFET, SerDes design, analog-to-digital conversion architectures (SAR, pipeline, TDC, delta-sigma), digital calibration algorithms, mixed-mode/RF modeling and simulation, electromigration and layout-dependent effects analysis, silicon characterization and debugging, fundamental analog/RF building blocks (amplifiers, filters, oscillators, LDOs), chip lead experience
Preferred skills
RF design concepts (noise figure, intercept points), mixed-signal architecture, device physics for process selection, chip-level ESD protection design, digital design and verification
Technologies
MATLAB, Simulink, SystemVerilog-AMS, Spectre, AMS flows
Responsibilities
Lead architecture and integration of high-speed data converters; Develop behavioral models for system validation; Utilize Spectre and AMS flows for circuit development; Collaborate with system architects on block-level requirements; Oversee layout, floorplanning, and tape-out verification; Work with validation engineers on test plans and bring-up; Mentor junior engineers on analog design practices
Seniority
Principal, hands-on IC design with mentorship