Lead Software Engineer
Core
R&D engineer developing the finite-element engine for electrothermal and thermomechanical simulation products, solving large-scale industrial geometry problems in parallel.
Role type
Senior IC numerical-methods engineer (C++ FEA solver)
Builds
Production C++ solver for temperature, warpage, and stress prediction in advanced packages, 3D-IC stacks, and PCBs
Domain
Semiconductor packaging / PCB / Computational Mechanics
Deliverable
production ML models | product features
Required skills
Finite element method (weak forms, isoparametric elements, Newton–Raphson), Continuum mechanics, Heat transfer / thermomechanical stress analysis, C++11 (pointers, memory ownership, templates), Sparse linear algebra, Numerical validation (analytical solutions, patch tests)
Preferred skills
Nonlinear FEA (large deformation, contact, plasticity), Parallel programming (OpenMP, MPI), Sparse solvers (MUMPS, PARDISO, PETSc), Mesh generation, Semiconductor packaging background
Technologies
C++, OpenMP, MPI, Git, Perforce, Linux, Windows
Responsibilities
Derive, implement, and verify finite-element formulations in production C++; Write unit and regression tests; Profile and optimize solver and meshing code for runtime and memory; Debug numerical issues (non-convergence, mesh quality, ill-conditioning); Write technical documentation for formulations and validation results; Collaborate with application engineers, QA, and product management
Seniority
Senior, hands-on IC
