Principal FEOL Technology Development Engineer
Core
Develop, optimize, and transfer front-end semiconductor processes for Power Trench MOSFETs and BCD devices to ensure manufacturability and performance.
Role type
Principal FEOL Technology Development Engineer
Builds
Reliable Power Trench MOSFETs and BCD devices
Domain
Semiconductor manufacturing (FEOL processes)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Front-end process module knowledge (Silicon, Epi, Diffusion, Etch, Photo, Thin Films), Process Integration in CMOS/BCDMOS or Discrete IGBTs/MOSFETs, Silicon semiconductor device physics, Process Flow Design for manufacturability, Electrical test data correlation, Failure analysis interpretation, Power packaging assembly and reliability, Process/Technology/Design FMEA development, DoE design and data analysis tools (JMP, Spotfire), TCAD process simulations, Design layout interpretation
Preferred skills
Backend (BGBM, STM) processes experience
Technologies
JMP, Spotfire, TCAD
Responsibilities
Set up and perform process and device simulations to determine initial process parameters, Design and perform experiments to determine process sequences and parameters, Analyze data from fabrication of test lots to determine optimization needs, Mentor and oversee 2-3 junior engineers, Work with Process Engineering to develop and optimize process modules, Support processing of initial test chip and transfer lots, Provide inputs to Device Engineers for layout rules, Recommend test structures and contribute to layout of test chip mask sets, Provide development updates to upper management and external customers
Seniority
Principal, hands-on IC with mentorship
