Principal Chip Lead
Core
Architecting, designing, and optimizing advanced power delivery systems (high-frequency, high-density power converters) for AI processors and data centers from concept to production.
Role type
Principal IC Chip Lead (Power Management)
Builds
High-performance power management ICs for AI and data center applications
Domain
Semiconductor / Analog Power IC Design
Deliverable
production ML models | product features
Required skills
Analog power IC design, switching converters design, transistor circuit design (bandgap, references, amplifiers, filters, PLLs, ADCs, regulators, sensors, DACs), device physics, deep sub-micron processes, Cadence design and verification tools, project management
Preferred skills
Experience leading chip projects with 5+ team members
Technologies
FinFet processes, Cadence
Responsibilities
Own top-level design and verification, partition blocks, drive design flow, design IP blocks, supervise floorplan and layout development, IC evaluation (bring-up, characterization, debug), develop test/qualification plans for mass production
Seniority
Principal, hands-on IC lead with mentorship
