Process Engineering Manager (Electroplating)
Core
Lead the development and optimization of next-generation electroplating processes and technologies for advanced semiconductor packaging applications.
Role type
Manager, Process Engineering (Electroplating)
Builds
Next-generation electroplating processes and technologies for advanced semiconductor packaging
Domain
Semiconductor manufacturing / Advanced packaging / Materials science
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Electroplating/electrochemical deposition expertise, Copper plating knowledge, Wafer-level packaging (RDL, copper pillars, TSVs), Process characterization, DOE, Statistical analysis, Root cause analysis, Plating chemistry, Deposition uniformity, Defect reduction, Process optimization, People leadership, Technical reporting
Preferred skills
Advanced packaging applications experience, Cross-functional collaboration, Customer engagement
Technologies
Electroplating equipment, Analytical instrumentation
Responsibilities
Manage engineers in hardware characterization, Develop and execute process engineering projects, Interact with key customers to resolve complex process issues, Develop and implement new technology and analytical instrumentation, Train and implement new methodologies and troubleshoot complex issues, Generate internal and external documentation and validate process engineering specifications
Seniority
Manager, hands-on IC with team leadership
