Director Pathfinder Solutions - Integrated Materials Solutions
Core
Develop and demonstrate next-generation integrated semiconductor process solutions for advanced logic (GAA, CFET) and memory (DRAM, NAND) device architectures, de-risking N+1 and N+2 technology nodes.
Role type
Senior IC technical leader (Director level)
Builds
Integrated pathfinding process flows and module demonstrations for N+1/N+2 nodes
Domain
Semiconductor manufacturing, advanced process integration, device physics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Advanced semiconductor process integration, device physics, DTCO analysis, hands-on process development, cross-BU coordination, customer technical engagement, publication/patent generation
Preferred skills
Experience at semiconductor equipment/materials company, DMTS designation, advanced device architecture expertise (GAA, CFET, 3D DRAM), advanced metallization knowledge
Technologies
Deposition, etch, implant, epitaxy, CMP, thermal processing, GAA, CFET, 3D DRAM, 4F2 DRAM, NAND, Mo, Cu, W
Responsibilities
Develop integrated pathfinding solutions for logic and memory architectures; drive hands-on process development across deposition, etch, implant, epitaxy, CMP, and thermal processing; engage with senior technologists at major customers (Samsung, Intel, TSMC); publish at premier conferences and build patent portfolio; coordinate wafer flow and DOE design across multiple BUs
Seniority
Director, hands-on IC technical leader