Engineering Director – Vacuum & Wet Systems- role based in Bangalore, India
Core
Lead the design, development, and delivery of advanced semiconductor process equipment, specifically focusing on Electrochemical Plating (ECP) and wet cleaning systems for chip and display manufacturing.
Role type
Senior Engineering Director (Semiconductor Hardware)
Builds
High-volume manufacturing (HVM) tool platforms and critical modules for semiconductor and display equipment.
Domain
Semiconductor manufacturing equipment, electrochemical plating, wet processing
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Vacuum system design, Electrochemical Plating (ECP) systems, wet cleaning equipment design, multi-physics system integration, root cause analysis, reliability engineering, cross-functional team leadership, global program execution
Preferred skills
Patents in semiconductor equipment, conference publications (SEMI, IEEE, ECS), experience with North American semiconductor OEMs
Technologies
Vacuum chambers, gas delivery systems, pumping systems, fluid delivery systems, current distribution architectures, chemical dispense modules, rinse/dry modules
Responsibilities
Drive end-to-end equipment design from concept to production release, lead multi-disciplinary engineering teams, optimize yield and defectivity control, collaborate across global time zones
Seniority
Director, hands-on IC with strategic leadership