Implant Process Engineer – Anneal/Surface Treatment
Core
Establish and maintain world-class implant processes (Thermal Anneal/RTP, Surface Treatment, Dry Etch) for wafer fabrication, focusing on new process qualification, tool-to-tool matching, and yield enhancement.
Role type
Process Engineer (Implant/Anneal/Surface Treatment)
Builds
Wafer fabrication processes and semiconductor devices
Domain
Semiconductor manufacturing (Implant department)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Wafer fabrication process qualification, tool-to-tool output matching, statistical process control (SPC), Change-Point Management (CPM), root-cause investigation, SOP development, cross-functional yield improvement
Preferred skills
Thermal Anneal (RTP) or Surface Treatment/Dry Etch process knowledge, experience with AMAT Centura/Radiance/DPN/DPX/DSA/Ajax, Mattson Millios/Suprema/Escala, LAM Argos, Semes HPA/LOHAS, Veeco LSA, Python/VBA scripting
Technologies
Spotfire, JMP, MATLAB, Excel, Microsoft Windows
Responsibilities
Qualify wafer fabrication processes on new tools, gather metrology data to ensure film properties meet specs, transfer/duplicate recipes across lines, monitor in-line issues and create troubleshooting plans, implement CPM and defense-lines, draft and update SOPs, maintain tool activity logs
Seniority
Mid-level, hands-on IC