Manufacturing Quality Engineer
Core
Lead new product introduction (NPI), process development, product transfer, and manufacturing readiness for semiconductor package assembly and high-reliability electronic products.
Role type
Manufacturing Quality Engineer (Semiconductor Packaging)
Builds
Semiconductor package assemblies and high-reliability electronic products
Domain
Semiconductor manufacturing and electronics assembly
Required skills
Semiconductor package assembly (flip-chip, die attach, wire bond), SMT, BGA characterization, PFMEA, Control Plans, SPC, DOE, root cause analysis (8D, DMAIC), failure analysis (AXI, CT scan, cross-sectioning), yield improvement, supplier quality management
Preferred skills
Advanced packaging technologies, EMS/ODM/contract manufacturing experience, Six Sigma Green/Black Belt, CQE certification, optical/photonics/telecommunications manufacturing experience
Technologies
AXI, CT scan, cross-sectioning, EDX, dye-and-pry, SMT, flip-chip, die attach, wire bond, BGA, dispensing, underfill
Responsibilities
Lead NPI activities from product transfer through production release; Develop and optimize semiconductor package assembly processes; Drive BGA characterization and assembly process validation; Establish manufacturing process documentation (PFMEA, Control Plans, Flow Diagrams); Define process controls and CTQ characteristics; Lead root cause investigations and corrective actions; Support failure analysis activities; Drive yield improvement and defect reduction; Manage non-conforming materials and MRB reviews; Support supplier quality activities and audits; Conduct DFM/DFX reviews
Seniority
Mid-level, hands-on IC
