Product Physical Failure Analysis Engineer
Core
Semiconductor Physical Failure Analysis Engineer responsible for root cause identification on yield, reliability, and customer returns for FPGA products.
Role type
Senior IC physical failure analysis engineer
Builds
Next generation FPGA product and package technologies
Domain
Semiconductor / FPGA / Hardware Reliability
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
root cause analysis, die milling/thinning, Focused Ion Beam (FIB) milling, Scanning Electron Microscopy (SEM), Energy Dispersive X-ray Spectroscopy (EDX), layout analysis, schematic analysis, design analysis, FMEA development, yield improvement, reliability risk assessment, fault isolation, report writing
Preferred skills
FPGA architecture knowledge, design debug features (DFT) understanding, Teradyne Ultraflex tester experience, semiconductor packaging failure analysis
Technologies
Virtuoso, Avalon, SysNav, Teradyne Ultraflex tester, Emission microscopes, Laser Voltage Probing, OBIRCH
Responsibilities
Collaborate with Product/Yield/Reliability Engineers to drive fault isolation during product development and reliability risk assessments; Support physical failure analysis and root cause determination of semiconductor device failures; Independently interpret Emission microscopes, Laser Voltage Probing, and OBIRCH data; Define and execute physical failure analysis tools such as SEM, FIB, and EDX; Develop reports and communicate findings to responsible engineers
Seniority
Senior, hands-on IC
